German semiconductor manufacturer Infineon Technologies is set to release the first silicon carbide (SiC) products based on its 200 mm SiC wafer manufacturing technology to customers during the first quarter of 2025. The products, for high-voltage applications such as EVs, trains and renewable energy, will be manufactured in Villach, Austria. The transition of Infineon’s manufacturing… Read more…
Infineon to release first 200 mm SiC devices for high-voltage applications
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