Residue-free pastes provide tackiness and printability, and do not leave residues behind after reflow. The advantage is a noticeable cost saving, as there is no need to clean the substrates after soldering. Residue-free pastes do not contain any activators. Therefore, formic acid must be used to deoxidize the solder powder and the interconnect surfaces for… Read more…
Webinar: Use of residue free pastes in vacuum soldering equipment
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Webinar: Use of residue free pastes in vacuum soldering equipment
Residue-free pastes provide tackiness and printability, and do not leave residues behind after reflow. The advantage is a noticeable cost saving, as there is no need to clean the substrates after soldering. Residue-free pastes do not contain any activators. Therefore, formic acid must be used to deoxidize the solder powder and the interconnect surfaces for… Read more…
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