The Chomerics division of Parker Hannifin Corporation will present a trio of new thermal interface materials at Electronica 2024, staged on November 12-15 in Munich, Germany.
Exhibiting at booth B3.236, the innovations on show will include new thermal, cure-in-place, gap-pad and dispensable gel products. The company is also planning to announce the launch of a rapid sampling and prototyping service. Read more…