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Components keep their cool in 3D


A feasibility study has examined the use of over-moulding to create 3D electronic components with high thermal conductivity (writes Nick Flaherty). The project, at Sobaplast in Germany, uses the Keratherm MT 103 and MT 320 injection moulding materials from Kerafol on circuit board samples at temperatures that did not compromise the components on the board […] More…

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